Data Center Cooling for High Density Infrastructure
Maktinta engineers cooling systems for high density data centers, AI infrastructure, server environments, and other facilities with demanding thermal loads.
Our work spans direct to chip liquid cooling, facility water loops, CDUs, dry coolers, chillers, heat rejection, controls, and hybrid liquid and air architectures.
Every system is designed around the actual rack density, climate, water temperature, redundancy requirements, and operating conditions of the facility.
Data Center Cooling Capabilities
Direct to Chip Cooling
Liquid is delivered through cold plates directly to the processors generating the highest heat loads, reducing the amount of heat that must be removed through room air.
Dry Coolers and Free Cooling
When outdoor conditions and facility water temperatures allow it, dry coolers can reject heat without requiring continuous compressor operation.
Coolant Distribution Units
CDUs isolate and manage the relationship between the technology cooling loop and the facility water system while controlling flow, temperature, pressure, and heat exchange.
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Chiller Plants
Maktinta evaluates compressor technology, lift, ambient conditions, loop temperature, and annual runtime to determine which chiller architecture fits the application.
Rear Door Heat Exchangers
Rear door systems capture heat as it leaves the rack and can supplement or replace portions of traditional room based air cooling.
Controls and Monitoring
Cooling equipment, pumps, valves, CDUs, chillers, and heat rejection systems are coordinated so the facility responds to changing thermal conditions as one system.
Cooling Architecture Starts With the Rack
The cooling system should begin with what is happening inside the rack, not with a predetermined piece of mechanical equipment.
Maktinta evaluates rack density, coolant requirements, facility water temperatures, supply and return conditions, climate, heat rejection, available infrastructure, and future compute loads before selecting the cooling architecture.
At lower densities, air cooling may still have a role. As rack density rises, direct liquid cooling, rear door heat exchangers, CDUs, and warm water loops become increasingly important.
The objective is to move heat from the processor to the outdoors using the least amount of energy and infrastructure required by the application.
The Facility Water Loop Changes Everything
The temperature of the facility water loop affects nearly every major cooling decision.
Warmer water can increase the number of hours when outdoor conditions can reject heat without mechanical refrigeration, reduce compressor lift, and change which chiller technology performs best.
Maktinta evaluates supply and return temperatures, CDU requirements, climate data, dry cooler approach, pumping energy, and equipment performance together rather than selecting each component independently.
The result is a cooling plant designed around the operating conditions of the complete system.
High Density Rack Cooling
Modern AI and high performance computing infrastructure creates thermal loads that traditional comfort cooling systems were never designed to handle.
Maktinta designs cooling architectures for rack densities well beyond conventional data center loads, including direct to chip systems and hybrid liquid and air configurations.
Our first high density deployment operated at approximately 75 kW per rack. Maktinta now designs cooling systems for rack densities up to approximately 150 kW.
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Direct to chip liquid cooling
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Rear door heat exchangers
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Coolant distribution units
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Facility water loops
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Hybrid liquid and air cooling
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Heat rejection and chiller integration
Choosing the Right Heat Rejection Architecture
There is no single chiller technology that is best for every data center.
High lift centrifugal chillers, magnetic bearing centrifugals, scroll compressors, dry coolers, and hybrid systems each perform differently depending on climate, loop temperature, required lift, and annual operating conditions.
Maktinta evaluates how the equipment will operate across the entire year rather than selecting a system based only on the design day.
That includes analyzing when dry cooling can carry the load, when mechanical refrigeration is required, how much compressor lift is necessary, and how the architecture changes across different climates and applications.
Proven High Density Performance
In one high density data center deployment, Maktinta engineered cooling for rack densities of approximately 75 kW while improving overall facility efficiency from a PUE of 1.50 to 1.09.
The improvement came from treating cooling, airflow, controls, and facility infrastructure as one system rather than optimizing individual pieces of equipment in isolation.
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75 kW Rack density in first high density deployment
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1.50 → 1.09 Facility PUE improvement
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Up to 150 kW Current rack density design capability
Cooling Efficiency Beyond Nameplate Ratings
Data center efficiency cannot be evaluated from chiller efficiency alone.
Pumps, fans, CDUs, controls, heat rejection equipment, compressors, loop temperatures, and operating hours all contribute to the energy required to remove heat from the facility.
Maktinta evaluates the complete cooling path from the rack to the outdoors to identify where energy is actually being consumed and where the architecture can be improved.
The goal is not simply to install efficient equipment. It is to create an efficient cooling system.
Engineering From the Rack to Heat Rejection
Maktinta remains involved from early thermal analysis through cooling architecture, equipment selection, controls, installation coordination, commissioning, and system performance review.
That continuity is especially important in liquid cooled environments where the rack, CDU, facility loop, pumping system, chiller plant, and outdoor heat rejection equipment all affect one another.